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Reading: Nothing’s future phones will pack Snapdragon chips, telephoto cameras, and eSIM support
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Nothing’s future phones will pack Snapdragon chips, telephoto cameras, and eSIM support

GEEK DESK
GEEK DESK
Dec 24

Nothing, known for its distinctive design and focus on user experience, is reportedly working on new budget-friendly smartphones with surprisingly high-end features. Code analysis of the latest Nothing OS 3.0 suggests that the upcoming Nothing Phone (3a), Nothing Phone (3a) Plus, and CMF Phone (2) could include Snapdragon processors, telephoto cameras, and eSIM support.

The Nothing Phone (3a) and (3a) Plus are rumored to feature the Snapdragon 7s Gen 3 SoC, while the CMF Phone (2) may utilize a MediaTek processor. A significant departure from previous Nothing phones is the potential inclusion of telephoto cameras. The Phone (3a) is expected to sport a telephoto lens, while the Phone (3a) Plus may feature a periscope zoom camera.

Another notable addition is the potential for eSIM support in the Nothing Phone (3a) and Phone (3a) Plus, allowing for dual-SIM configurations with either two physical SIM cards or an eSIM and a physical SIM.

These rumored features suggest that Nothing is aiming to offer more premium features in its budget-friendly devices, potentially increasing its competitiveness in the smartphone market.

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